Alphane Moon@lemmy.ml to

Hardware@lemmy.mlEnglish · 5 months ago

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

www.anandtech.com

0

cross-posted to:
hardware@lemmy.ml

1

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

www.anandtech.com

Alphane Moon@lemmy.ml to

Hardware@lemmy.mlEnglish · 5 months ago

0

cross-posted to:
hardware@lemmy.ml

You must log in or register to comment.

Chat

Hardware@lemmy.ml

hardware@lemmy.ml

You are not logged in. However you can subscribe from another Fediverse account, for example Lemmy or Mastodon. To do this, paste the following into the search field of your instance: !hardware@lemmy.ml

This is a community dedicated to the hardware aspect of technology, from PC parts, to gadgets, to servers, to industrial control equipment, to semiconductors.

Rules:

Posts must be relevant to electronic hardware
No NSFW content
No hate speech, bigotry, etc

Visibility: Public

This community can be federated to other instances and be posted/commented in by their users.

6 users / day
6 users / week
6 users / month
19 users / 6 months
0 local subscribers
4.85K subscribers
58 Posts
0 Comments
Modlog

mods: